Fluorine barrier layer between conductor and insulator for degra

Semiconductor device manufacturing: process – Gettering of substrate – By implanting or irradiating

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438475, 438477, 438963, 438798, 438781, H01L 21322

Patent

active

059306556

ABSTRACT:
Method of improving the resistance of a metal against degradation from exposure to fluorine released from a fluorine-containing material by forming a fluorine-barrier layer between the insulator material and the metal. The invention is especially useful in improving corrosion and poisoning resistance of metallurgy, such as aluminum metallurgy, in semiconductor structures. The invention also covers integrated circuit structures made by this method.

REFERENCES:
patent: 4300989 (1981-11-01), Chang
patent: 5181985 (1993-01-01), Lampert et al.
patent: 5219791 (1993-06-01), Freiberger
patent: 5306671 (1994-04-01), Ogawa et al.
patent: 5378317 (1995-01-01), Kashiwase et al.
patent: 5380397 (1995-01-01), Fukuyama et al.
patent: 5384281 (1995-01-01), Kenney et al.
patent: 5397748 (1995-03-01), Watanabe et al.
patent: 5423945 (1995-06-01), Marks et al.
patent: 5451543 (1995-09-01), Woo et al.
patent: 5466638 (1995-11-01), Eguchi
patent: 5527718 (1996-06-01), Seita et al.
patent: 5821175 (1998-10-01), Engelsberg et al.
Japanese Patent Appl. Abstract, JP 07094606 (publ. Apr. 7, 1995), 1995 Derwent Info. Ltd.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Fluorine barrier layer between conductor and insulator for degra does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fluorine barrier layer between conductor and insulator for degra, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fluorine barrier layer between conductor and insulator for degra will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-891769

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.