Fluidic MEMS device

Details Fluidic MEMS device Fluidic MEMS device

2008-07-01

2008-07-01

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S026000, C438S052000, C438S053000, C257SE21502, C257SE21503

Reexamination Certificate

active

07393712

ABSTRACT:
A method of manufacturing a fluidic MEMS package includes attaching a cover plate with a plurality of openings to a substrate with a plurality of bond rings with breaches such that the cover plate, the substrate and the bond rings define a plurality of respective inner cavities. The cover plate, the substrate and the breaches define a plurality of respective fill ports. The method also includes filling the inner cavities with fluid, sealing the fluid in the inner cavities, and singulating a plurality of MEMS packages from the substrate.

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