Cleaning and liquid contact with solids – Processes – Using sequentially applied treating agents
Reexamination Certificate
2005-11-23
2009-02-24
Stinson, Frankie L (Department: 1792)
Cleaning and liquid contact with solids
Processes
Using sequentially applied treating agents
C134S036000
Reexamination Certificate
active
07494550
ABSTRACT:
A method for rinsing a semiconductor wafer in a module utilizing a fluid delivery ring is provided. The method includes providing a process bowl having a generally circular shape bottom wall, a sidewall that extends upwardly from the bottom wall to define a cylindrical chamber, and a plurality of channels in the sidewall that extend from the bottom wall to an upper edge of the sidewall. A fluid delivery ring is attached onto the sidewall of the process bowl. Utilizing the process bowl, a plurality of supply tubes is inserted into the fluid delivery ring. The fluid delivery ring has a plurality of ring inlet and outlet pairs and a plurality of respective slots. Fluid is supplied to the supply tubes, and fluid is directed onto a surface of the semiconductor wafer defined within the process bowl.
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WIPO WO 99/44585 Oct. 199.
Smith Stephen M.
Treur Randolph E.
Lam Research Corporation
Martine & Penilla & Gencarella LLP
Stinson Frankie L
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