Floating gate engineering to improve tunnel oxide reliability fo

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438197, 438923, 257 52, 257 64, 257288, H01L 21336, H01L 218234, H01L 31072, H01L 2904, H01L 2972

Patent

active

061534706

ABSTRACT:
A method of forming floating gate to improve tunnel oxide reliability for flash memory devices. A substrate having a source, drain, and channel regions is provided. A tunnel oxide layer is formed over the substrate. A floating gate is formed over the tunnel oxide and the channel region, the floating gate being multi-layered and having a second layer sandwiched between a first layer and a third layer. The first layer of the floating gate overlying the tunnel oxide layer includes an undoped or lightly doped material. The second layer is highly-doped. The third layer is in direct contact with a dielectric layer, e.g., an oxide-nitride-oxide stack, and is made of an undoped or lightly doped material. A dielectric material is formed over the floating gate and a control gate is formed over the dielectric material.

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