4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Flip chip

Peter Bodo

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active

Bumps in grooves for elastic positioning

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Flip-chip type connection with elastic contacts

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent

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High density electrical connectors

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent

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Method for making elastic bumps from a wafer mold having grooves

Plastic and nonmetallic article shaping or treating: processes – With step of cleaning – polishing – or preconditioning...
Patent

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Via structure

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent

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Profile ID: LFUS-PAI-P-1027273

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