Flip-chip package and method of forming thereof

Details Flip-chip package and method of forming thereof Flip-chip package and method of forming thereof

2007-12-21

2009-12-29

Dang, Phuc T (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S777000, C257S779000, C438S107000, C438S108000

Reexamination Certificate

active

07638882

ABSTRACT:
A flip-chip package is disclosed. The flip-chip package includes a substrate comprising at least one build-up layer. At least one longitudinal trench is formed in at least one build-up layer of the substrate. The at least one longitudinal trench filled with a conductive material. A conductive plane may be disposed at least partially on the at least one longitudinal trench. An insulating layer may cover the conductive plane and, at least in part, at least one build-up layer of the substrate. The solder resist layer may include a plurality of openings partially exposing the conductive plane. A plurality of conductive pads may be disposed on the conductive plane through the plurality of openings. A method for fabricating the flip-chip package is also disclosed.

REFERENCES:
patent: 2004/0126547 (2004-07-01), Coomer
patent: 2006/0138591 (2006-06-01), Amey et al.
patent: 2006/0170101 (2006-08-01), Kaizuka
patent: 2008/0000674 (2008-01-01), Dory et al.

Affiliated with

Also associated with

Rating

Flip-chip package and method of forming thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flip-chip package and method of forming thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flip-chip package and method of forming thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4068452