4. Electrical connectors
  5. Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
  6. With provision to conduct electricity from panel circuit to...

Bob Sankman

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active

Chip package and method

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Flip-chip package and method of forming thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Guided heating apparatus and method for using the same

Electric heating – Microwave heating – With diverse-type heating
Reexamination Certificate

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Guided heating apparatus and method for using the same

Electric heating – Microwave heating – Enclosed cavity structure
Reexamination Certificate

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Integrated circuit package

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2361985

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