4. Plastic and nonmetallic article shaping or treating: processes
  5. Forming continuous or indefinite length work
  6. Shaping by extrusion

Yoshihiro Yoneda

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BGA semiconductor device including a plurality of semiconductor

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Communication device and communication method

Multiplex communications – Low speed asynchronous data system – Channels separated in frequency
Reexamination Certificate

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Double-faced adhesive tape and wing with the same

Toilet – Hair device – Hair structures
Reexamination Certificate

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Flip chip mounting substrate with resin filled between substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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Flip-chip mount board and flip-chip mount structure with...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Profile ID: LFUS-PAI-P-984838

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