Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2007-08-21
2007-08-21
Mulpuri, Savitri (Department: 2812)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S046000, C438S108000
Reexamination Certificate
active
10920101
ABSTRACT:
Light emitting device die having a mesa configuration on a substrate and an electrode on the mesa are attached to a submount in a flip-chip configuration by forming predefined pattern of conductive die attach material on at least one of the electrode and the submount and mounting the light emitting device die to the submount. The predefined pattern of conductive die attach material is selected so as to prevent the conductive die attach material from contacting regions of having opposite conductivity types when the light emitting device die is mounted to the submount. The predefined pattern of conductive die attach material may provide a volume of die attach material that is less than a volume defined by an area of the electrode and a distance between the electrode and the submount. Light emitting device dies having predefined patterns of conductive die attach material are also provided. Light emitting devices having a gallium nitride based light emitting region on a substrate, such as a silicon carbide substrate, may also be mounted in a flip-chip configuration by mounting an electrode of the gallium nitride based light emitting region to a submount utilizing a B-stage curable die epoxy. Light emitting device dies having a B-stage curable die epoxy are also provided.
REFERENCES:
patent: 5046161 (1991-09-01), Takada
patent: 5060027 (1991-10-01), Hart et al.
patent: 5068708 (1991-11-01), Newman
patent: 5117279 (1992-05-01), Karpman
patent: 5118584 (1992-06-01), Evans et al.
patent: 5438477 (1995-08-01), Pasch
patent: 5506451 (1996-04-01), Hyugaji
patent: 5672542 (1997-09-01), Schwiebert
patent: 5694482 (1997-12-01), Maali et al.
patent: 5760479 (1998-06-01), Yang et al.
patent: 5773882 (1998-06-01), Iwasaki
patent: 5972739 (1999-10-01), Funada et al.
patent: 6057222 (2000-05-01), Pahl et al.
patent: 6146984 (2000-11-01), Leibovitz et al.
patent: 6168972 (2001-01-01), Wang et al.
patent: 6189208 (2001-02-01), Estes et al.
patent: 6189772 (2001-02-01), Hembree
patent: 6213789 (2001-04-01), Chua et al.
patent: 6214733 (2001-04-01), Sickmiller
patent: 6222279 (2001-04-01), Mis et al.
patent: 6224690 (2001-05-01), Andricacos
patent: 6400033 (2002-06-01), Darveaux
patent: 6455878 (2002-09-01), Bhat et al.
patent: 6498355 (2002-12-01), Harrah et al.
patent: 6506681 (2003-01-01), Grigg et al.
patent: 6614056 (2003-09-01), Tarsa et al.
patent: 6657236 (2003-12-01), Thibeault et al.
patent: 2001/0006235 (2001-07-01), Ozawa
patent: 2001/0032985 (2001-10-01), Bhat et al.
patent: 2002/0068373 (2002-06-01), Lo et al.
patent: 2002/0070386 (2002-06-01), Krames et al.
patent: 2002/0076854 (2002-06-01), Pierce
patent: 2002/0139987 (2002-10-01), Collins, III et al.
patent: 2004/0026709 (2004-02-01), Bader et al.
patent: 0589524 (1994-03-01), None
patent: 0843365 (1998-05-01), None
patent: 1020935 (2000-07-01), None
patent: 2610451 (1988-08-01), None
patent: 55148477 (1979-05-01), None
patent: 55009442 (1980-01-01), None
patent: 56064484 (1981-06-01), None
patent: 02206136 (1990-08-01), None
patent: 04152645 (1992-05-01), None
patent: 05029364 (1993-02-01), None
patent: 08172219 (1994-12-01), None
patent: WO 01/47039 (2001-06-01), None
patent: WO 01/69978 (2001-09-01), None
Epoxy Technology: Products—B Stage. http://www.epotek.com/b—stage.html. Feb. 27, 2002.
B-Definitions: B Stage. http://www.isl-gamet.uah.edu/Composites/b.html. Feb. 27, 2002.
International Search Report for PCT/US02/23120, dated May 16, 2003.
International Search Report for PCT/US02/23067, dated Jun. 4, 2003.
Abstract. “Thermosonic bonding: an alternative to area-array solder connections,” Sa Yoon Kang, Teh-hua Ju, and Y. C. Lee, Electronic Components and Technology Conference, Florida, Jun. 2-4, 1993, XP-002241923.
Abstract. “Light emitting diode holder for various electrical instrument LED mounting,” A. N. Soldatenkov, Derwent Publications Ltd, London, GB, AN 1995-013018, Jul. 15, 1993, XP-002241924.
Andrews Peter S.
Bharathan Jayesh
Edmond John
Mohammed Anwar
Negley Gerald H.
Cree Inc.
Cree Microwave LLC
Mulpuri Savitri
Myers Bigel Sibley & Sajovec P.A.
LandOfFree
Flip-chip bonding of light emitting devices does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Flip-chip bonding of light emitting devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flip-chip bonding of light emitting devices will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3834203