Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2008-04-08
2008-04-08
Le, Thao X. (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
Reexamination Certificate
active
11485226
ABSTRACT:
A flip chip bonded package applicable to a fine pitch technology uses, inter alia, insulative posts instead of using conductive bumps, which correspond to electrodes one by one. The insulative posts are assigned to every two bonding pads for the sake of flip chip bonding. This makes it possible to fabricate flip chip bonded packages very easily without modifying conventional processes. Larger bumps are provided even in the case of a technology having the same pad size and pitch during flip chip bonding. This makes the subsequent attachment process easy and reduces the defective ratio. The insulative posts, when made of a polymer, also act as stress buffers. This improves the reliability of the package.
REFERENCES:
patent: 5656550 (1997-08-01), Tsuji et al.
patent: 6177721 (2001-01-01), Suh et al.
patent: 2005/0064624 (2005-03-01), Murakami
patent: 2003-142512 (2003-05-01), None
patent: 10-1997-0053166 (1997-07-01), None
patent: 10-2004-0023501 (2004-03-01), None
patent: 10-2006-0041453 (2006-05-01), None
Korean Patent Gazettle from the Korean Patent Office.
Harrison Monica
Hynix / Semiconductor Inc.
Ladas & Parry LLP
Le Thao X.
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