Flip-chip assembly and method of manufacturing the same

Details Flip-chip assembly and method of manufacturing the same Flip-chip assembly and method of manufacturing the same

2007-11-28

2010-10-26

Toledo, Fernando L (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257SE23010, C257SE21505, C438S108000, C438S115000

Reexamination Certificate

active

07821139

ABSTRACT:
A flip-chip assembly comprises a semiconductor chip, a substrate, a first buffer layer, a second buffer layer and a conductive bump. The semiconductor chip includes a first region and a second region adjacent to the first region. The substrate is disposed under the semiconductor chip. The first buffer layer is disposed between the first region of the semiconductor chip and the substrate. The second buffer layer is disposed between the second region of the semiconductor chip and the substrate. The conductive bump is formed through the second buffer layer and electrically connects the semiconductor chip to the substrate.

REFERENCES:
patent: 6190940 (2001-02-01), DeFelice et al.
patent: 6566612 (2003-05-01), Brouillette et al.
patent: 6927490 (2005-08-01), Franzon et al.
patent: 6940161 (2005-09-01), Kawanobe et al.
patent: 2003/0100200 (2003-05-01), Franzon et al.
patent: 2005/0046037 (2005-03-01), Franzon et al.
patent: 2005/0157244 (2005-07-01), Hwang et al.
patent: 2005/0224969 (2005-10-01), Wu
patent: 2006/0087045 (2006-04-01), Yamano et al.
patent: 2008/0284012 (2008-11-01), Okayama et al.
patent: 2000-150576 (2000-05-01), None
patent: 2003-224454 (2003-08-01), None
patent: 2005-84487 (2005-08-01), None
patent: 2006-0041453 (2006-05-01), None
English language abstract of Japanese Publication No. 2000-150576.
English language abstract of Japanese Publication No. 2003-224454.
English language abstract of Korean Publication No. 2005-84487.
English language abstract of Korean Publication No. 2006-0041453.

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