Fixture used to prepare semiconductor specimens for film...

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure

Reexamination Certificate

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C438S048000, C257S350000

Reexamination Certificate

active

06936843

ABSTRACT:
The present disclosure pertains to a method of preparing a test specimen for testing of the bonding strength of a layer of additive material to a crystalline substrate, or testing of the bonding strength of one layer of additive material to a second layer of additive material, where both layers of additive material overlie a crystalline substrate. The method includes both test specimen “cutting” from a large sample of material and preparation of an individual test specimen for four-point adhesion testing. Also described is a fixture which is useful for cutting the individual test specimen from the large sample of material.

REFERENCES:
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patent: 6486514 (2002-11-01), Jeong et al.
patent: 6506664 (2003-01-01), Beyne et al.
patent: 6716660 (2004-04-01), Jeong et al.
patent: 6730997 (2004-05-01), Beyne et al.
R. H. Dauskardt et al., “Adhesion and Debonding of Multi-Layer Thin Film Structures”,Engineering Fracture Mechanics, 61(1), pp. 141-162 (1998);.
M. Lane et al., “Adhesion and Reliability of Copper Interconnects with Ta and TaN Barrier Layers”,J. Mat. Res., 15(1), pp. 203-211 (2000).
Q. Ma et al., “Quantitative Measurement of Interface Fracture Energy in Multi-Layer Thin Film Structures”,Proceedings of MRS Annual Meeting, San Francisco, CA, pp. 3-14 and 91-96 (1995).

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