Semiconductor device manufacturing: process – Making field effect device having pair of active regions...
Reexamination Certificate
2007-02-27
2007-02-27
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Reexamination Certificate
active
10905615
ABSTRACT:
A method of manufacturing fin-type field effect transistors (FinFETs) forms a silicon layer above a substrate, forms a mask pattern above the silicon layer using a multi-step mask formation process, patterns the silicon layer into silicon fins using the mask pattern such that the silicon fins only remain below the mask pattern, removes the mask pattern to leave the fins on the substrate, and forms gate conductors over the fins at a non-perpendicular angle to the fins.
REFERENCES:
patent: 5675164 (1997-10-01), Brunner et al.
patent: 6413802 (2002-07-01), Hu et al.
patent: 6642090 (2003-11-01), Fried et al.
patent: 6662350 (2003-12-01), Fried et al.
patent: 6794718 (2004-09-01), Nowak et al.
patent: 6909174 (2005-06-01), Schoenborn
patent: 2002/0153587 (2002-10-01), Adkisson et al.
patent: 2003/0067017 (2003-04-01), Ieong et al.
patent: 2004/0036464 (2004-02-01), Fried et al.
Anderson Brent A.
Bernstein Kerry
Nowak Edward J.
Gibb I.P. Law Firm LLC
Harrison Monica D.
International Business Machines - Corporation
Jr. Carl Whitehead
Sabo, Esq. William D.
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