Fine pattern forming method

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Electron beam imaging

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430270, 430313, 430317, 430323, 430326, 430330, 430942, G03C 500

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054767539

ABSTRACT:
A high polymer organic film is applied as a bottom layer to a semiconductor silicon substrate. Then, a material including an acid generator and a polysilane resin insoluble in an alkaline solution is applied to the bottom layer as an electron beam resist layer. The polysilane resin includes a Si--Si bond or Si--O bond in a principle chain and a substituted hydroxy group expressed as --OR in a side chain wherein R denotes a substitution group of hydrocarbon. The acid generator generates an acid when irradiated with an electron beam. Then, a pattern is formed with an electron beam in the photosensitive layer, and it is developed with an alkaline solution. Then, by using the resist pattern as a mask, the bottom layer is etched. Thus, a fine resist pattern of correct high aspect ratio can be formed easily.

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Patent & Trademark Office English Translation of Japanese Patent 4-50947 (Pub. Date Feb. 19, 1992).
Patent & Trademark Office English Translation of Japanese Patent 2-248952 (Pub Date Oct. 4, 1990).
"Chemistry and Technology of Silicones" by Walter Noll 1968, pp. 1--3, 9-16.
"Grant & Hackh's Chemical Dictionary", 5th Edition 1987 p. 290.
The Role of the Latent Image in a New Dual Image, Aqueous Developable, Thermally Stable Photoresist. Wayne E. Feely et al., Polymer Engineering and Science, Mid-Summer, 1986, vol. 26, No. 16 pp. 1101-1104.

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