Fine pattern forming material and pattern forming method

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Electron beam imaging

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

430313, 430317, 430323, 430325, 430330, 430942, 2504921, 2504922, 2504923, G03C 500

Patent

active

053066014

ABSTRACT:
Herein is provided a fine pattern forming method which is prevented from the charging-up phenomenon at the time of electric charged beam writing owing to the use of a polyalkylthiophene type conductive polymeric substance or a quaternary ammonium ion type polymeric substance in a monolayer or multilayer resist.

REFERENCES:
patent: 4266004 (1981-05-01), Kern
patent: 4521589 (1985-06-01), Yamamoto
patent: 4711742 (1987-12-01), Jen
patent: 4737557 (1988-04-01), Sato
patent: 4985319 (1991-01-01), Watakabe
patent: 5051338 (1991-09-01), Kato
Fredericks: IBM Technical Disclosure Bulletin 20(4), Sep. 1977, p. 1444.
Todokoro: International Electron Devices Meeting Dec. 1977, pp. 753-756.
Elliot: "Integrated Circuit Fabrication Technology" 1982, p. 27.
Chemical Abstracts, vol. 108, No. 24, Jun. 13th, 1988, p. 619, abstract No. 21367r, Columbus, Ohio, US; K. Yoshino et al.: "Spectral change of polymer film containing poly(3-alkylthiophene) with temperature and its application as optical recording media", & Jpn. J. Appl. Phys., Part 2, 1988, 27(3), L454-L456.
Chemical Abstracts, vol. 93, No. 3, Aug. 1980, p. 767, abstract No. 58156s, Columbus, Ohio, US; H. Tanaka et al.: "Synthesis of polymers containing sulfide bonds in the main chain and application as positive type resist", & Kobunishi Ronbunshu 1989, 37(4), 269-74.
Patent Abstracts of Japan, vol. 8, No. 157 (P-288)(1594), Jul. 29th, 1984; & JP-A-59 053 837 (Nippon Denshin Kosha) Mar. 28, 1984.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Fine pattern forming material and pattern forming method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fine pattern forming material and pattern forming method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fine pattern forming material and pattern forming method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1710911

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.