Fin field effect transistor and method of fabricating the same

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation

Reexamination Certificate

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C257SE29255

Reexamination Certificate

active

07968442

ABSTRACT:
A fin field effect transistor includes a fin protruding from a semiconductor substrate, a gate insulating layer formed so as to cover upper and lateral surfaces of the fin, and a gate electrode formed across the fin so as to cover the gate insulating layer. An upper edge of the fin is rounded so that an electric field concentratedly applied to the upper edge of the fin through the gate electrode is dispersed. A thickness of a portion of the gate insulating layer formed on an upper surface of the fin is greater than a thickness of a portion of the gate insulating layer formed on a lateral surface of the fin, in order to reduce an electric field applied through the gate electrode.

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patent: 10-2007-0024965 (2007-03-01), None

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