Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-11-06
2007-11-06
Ghyka, Alexander (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S108000, C257S704000, C257S737000, C257SE23145
Reexamination Certificate
active
10623068
ABSTRACT:
A filter device and a method for fabricating filter devices can package filters, especially acoustic wave filters, by bonding a carrier (substrate) wafer carrying manufactured filters to another wafer referred to as a capping wafer. A capping wafer/substrate eliminates the need for a conventional package to protect the sensitive filters, which reduces both product size and product costs significantly. Even though additional packaging is possible (i.e. in plastic molded packages, or in glob-top packages), it is not required for the reliability of the filters.
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Aigner Robert
Elbrecht Lüder
Ellä Juha Sakari
Pohjonen Katri Helena
Tikka Pasi
Ghyka Alexander
Greenberg Laurence A.
Infineon Technologies A.G.
Locher Ralph E.
Nokia Corporation
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