Film thickness measuring device and method

Optics: measuring and testing – By configuration comparison – With photosensitive film or plate

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356328, G01B 1106

Patent

active

046766472

ABSTRACT:
Apparatus and a method are disclosed for measuring the thickness of a very thin transparent film formed, for example, on a photomask or wafer for an integrated circuit. Diffracted reflected light from a film specimen is converted photoelectrically by use of a one dimensional image sensor array and then by an A/D converter having a resolution of more than 2.sup.10, which allows for discrimination into 1,000 graduations of output level. Enhanced precision in determining film thickness is obtained by utilizing this high discrimination to first determine the variations among individual elements of the one dimensional sensor array and compensating for them, as well as by using known averaging and statistical techniques to generate output for comparison to reference data from film specimens of known thickness.

REFERENCES:
patent: 3645623 (1972-02-01), Patten
patent: 4254337 (1981-03-01), Yasujima et al.
patent: 4308586 (1981-12-01), Coates
patent: 4355903 (1982-10-01), Sandercock
patent: 4606641 (1986-08-01), Yamada et al.

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