Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Reexamination Certificate
2008-08-29
2010-11-16
Arora, Ajay K (Department: 2892)
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
C257SE21495, C257S775000, C438S694000, C349S150000
Reexamination Certificate
active
07833910
ABSTRACT:
In a film substrate (FB) including a film base material (1) and conductor wiring (23) that is formed on the film base material (1), the conductor wiring (23) is arranged such that the conductor wiring thickness of an external connection portion on the film substrate to which another panel or substrate is connected is thicker than the conductor wiring thickness of conductor wiring portions (bent portions) (25) at other positions.
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Arora Ajay K
Panasonic Corporation
Steptoe & Johnson LLP
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