Film formation method and apparatus for forming silicon...

Coating processes – Electrical product produced

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C427S255370

Reexamination Certificate

active

07906168

ABSTRACT:
An oxide film is formed on a target substrate by CVD, in a process field to be selectively supplied with a first process gas including a silicon source gas and a second process gas including an oxidizing gas. The oxide film is formed by performing cycles each alternately including first and second steps. The first step performs supply of the first process gas, thereby forming an adsorption layer containing silicon on a surface of the target substrate. The second performs supply of the second process gas, thereby oxidizing the adsorption layer on the surface of the target substrate. The silicon source gas is a univalent or bivalent aminosilane gas, and each of the cycles is arranged to use a process temperature lower than that used for a trivalent aminosilane gas.

REFERENCES:
patent: 6391803 (2002-05-01), Kim et al.
patent: 6667236 (2003-12-01), Meijer et al.
patent: 2007/0275166 (2007-11-01), Thridandam et al.
patent: 2003-007700 (2003-01-01), None
patent: 2004-281853 (2004-10-01), None
patent: 2004281853 (2004-10-01), None
JPO, JP 2004-281853 Machine Translation, Nov. 30, 2009.
Xiangna et al., Investigation of Nitrogen Content Influence on Electron Spin Resonance in a-Si:H/ a-SiN:H Mulatlatyers, Chinese Physics Letters, vol. 7, No. 2(1990), p. 79-82.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Film formation method and apparatus for forming silicon... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Film formation method and apparatus for forming silicon..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Film formation method and apparatus for forming silicon... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2713410

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.