Film formation apparatus and method for using same

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step

Reexamination Certificate

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C438S706000, C134S001000, C134S001100, C134S001300, C134S019000, C118S7230MP, C257SE21483, C257SE21294

Reexamination Certificate

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08080477

ABSTRACT:
A method for using a film formation apparatus for a semiconductor process to form a thin film on a target substrate inside a reaction chamber includes performing a cleaning process to remove a by-product film deposited on a predetermined region in a gas route from a film formation gas supply system, which supplies a film formation gas contributory to film formation, through the reaction chamber to an exhaust system, by alternately repeating an etching step and an exhaust step a plurality of times in a state where the reaction chamber does not accommodate the target substrate. The etching step includes supplying a cleaning gas in an activated state for etching the by-product film onto the predetermined region, thereby etching the by-product film. The exhaust step includes stopping supply of the cleaning gas and exhausting gas by the exhaust system from a space in which the predetermined region is present.

REFERENCES:
patent: 6242347 (2001-06-01), Vasudev et al.
patent: 7494943 (2009-02-01), Noro et al.
patent: 7938080 (2011-05-01), Noro et al.
patent: 2001/0027030 (2001-10-01), Vasudev et al.
patent: 2005/0279454 (2005-12-01), Snijders
patent: 2006/0081182 (2006-04-01), Okada et al.
patent: 2008/0142046 (2008-06-01), Johnson et al.
patent: 1958878 (2007-05-01), None
patent: 3-293726 (1991-12-01), None
patent: 10-156172 (1998-06-01), None
patent: 1999-014078 (1999-02-01), None
Nobutaka Nodera, et al.; Film Formation Apparatus for Semiconductor Process.
Chinese Office Action issued on May 18, 2011 for Application No. 200810179942.5 with English translation.
Korean Office Action issued on Jul. 11, 2011 for Application No. 10-2008-0099370 w/ English language translation.

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