Film carrier tape and laminated multi-chip semiconductor device

Details Film carrier tape and laminated multi-chip semiconductor device Film carrier tape and laminated multi-chip semiconductor device

1991-07-09

1997-05-20

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257675, 257686, 257707, 257724, 29741, 438122, 438109, H01L 23495, H01L 2302

Patent

active

056314973

ABSTRACT:
A film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof wherein a plurality of chip semiconductor devices are laminated onto a substrate. Each chip semiconductor device includes a film carrier tape having leads, a semiconductor chip electrically connected to the leads, a heat sink mounted to a surface of the chip, and a connector for mounting the heat sink, the connector being electrically connected to the leads of the film carrier tape. The film carrier tape includes a carrier member having a metallic layer superposed thereon which is etched so as to form the leads and the heat sink.

REFERENCES:
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patent: 4331831 (1982-05-01), Ingram et al.
patent: 4635092 (1987-01-01), Yerman et al.
patent: 4716124 (1987-12-01), Yerman et al.
patent: 4809053 (1989-02-01), Kuraishi
patent: 4954878 (1990-09-01), Fox et al.
patent: 5023202 (1991-06-01), Long et al.
patent: 5073521 (1991-12-01), Braden
patent: 5114880 (1992-05-01), Lin

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