Film carrier tape and laminated multi-chip semiconductor device

Details Film carrier tape and laminated multi-chip semiconductor device Film carrier tape and laminated multi-chip semiconductor device

1997-02-05

1998-09-08

Ostrowski, David

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257675, 257686, 257707, 257724, 438109, 438122, 29741, H01L 23495, H01L 2302

Patent

active

058048723

ABSTRACT:
A film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof wherein a plurality of chip-semiconductor devices are laminated onto a substrate. Each chip semiconductor device includes a film carrier tape having leads, a semiconductor chip electrically connected to the leads, a heat sink mounted to a surface of the chip, and a connector for mounting the heat sink, the connector being electrically connected to the leads of the film carrier tape. The film carrier tape includes a carrier member having a metallic layer superposed thereon which is etched so as to form the leads and the heat sink.

REFERENCES:
patent: 4132856 (1979-01-01), Hutchinson et al.
patent: 4809053 (1989-02-01), Kuraishi
patent: 5631497 (1997-05-01), Miyano et al.

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