Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate
2010-09-10
2011-12-27
Ghyka, Alexander (Department: 2812)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
C438S278000, C257SE21270, C257SE21409
Reexamination Certificate
active
08084371
ABSTRACT:
Field effect transistors, methods of fabricating a carbon insulating layer using molecular beam epitaxy and methods of fabricating a field effect transistor using the same are provided, the methods of fabricating the carbon insulating layer include maintaining a substrate disposed in a molecular beam epitaxy chamber at a temperature in a range of about 300° C. to about 500° C. and maintaining the chamber in vacuum of 10−11Torr or less prior to performing an epitaxy process, and supplying a carbon source to the chamber to form a carbon insulating layer on the substrate. The carbon insulating layer is formed of diamond-like carbon and tetrahedral amorphous carbon.
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Seo David
Seo Sun-ae
Shin Jai-kwang
Ghyka Alexander
Harness & Dickey & Pierce P.L.C.
Nikmanesh Seahvosh
Samsung Electronics Co,. Ltd.
The Board of Trustees of the Leland Stanford Junior University
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