Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2009-04-28
2010-11-02
Tran, Minh-Loan T (Department: 2826)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C257SE29121
Reexamination Certificate
active
07824993
ABSTRACT:
A method for fabricating a field-effect transistor with local source/drain insulation. The method includes forming and patterning a gate stack with a gate layer and a gate dielectric on a semiconductor substrate; forming source and drain depressions at the gate stack in the semiconductor substrate; forming a depression insulation layer at least in a bottom region of the source and drain depressions; and filling the at least partially insulated source and drain depressions with a filling layer for realizing source and drain regions. Further, the step of forming source and drain depressions at the gate stack in the semiconductor substrate includes that first depressions are formed for realizing channel connection regions in the semiconductor substrate, spacers are formed at the gate stack, and second depressions are formed using the spacers as a mask in the first depressions and in the semiconductor substrate.
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Holz Juergen
Schruefer Klaus
Tews Helmut
Brinks Hofer Gilson & Lione
Cruz Leslie Pilar
Infineon - Technologies AG
Tran Minh-Loan T
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