Field effect transistor with a high breakdown voltage and...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S336000, C257S344000, C257S401000, C257S408000, C257SE29148, C257SE29149, C257SE29265, C257SE29320, C257SE21143, C257SE21435

Reexamination Certificate

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07465978

ABSTRACT:
An electric field effect transistor of high breakdown voltage and a method of manufacturing the same are disclosed. A recessed portion is formed at the channel region and is filled by a protective oxide layer. Lightly doped source/drain regions are formed under the protective oxide layer. The protective oxide layer protects the lightly doped source/drain regions. Accordingly, the protective oxide layer prevents the electric field from being concentrated to a bottom corner portion of the gate structure. In addition, the effective channel length is elongated since an electric power source is connected to heavily doped source/drain regions from an outside source of the transistor, instead of being connected to lightly doped source/drain regions.

REFERENCES:
patent: 5635417 (1997-06-01), Natsume
patent: 5899726 (1999-05-01), Wang et al.
patent: 6114736 (2000-09-01), Balasubramanyam et al.
patent: 6144538 (2000-11-01), Chao
patent: 6333234 (2001-12-01), Liu
patent: 6465311 (2002-10-01), Shenoy
patent: 6483158 (2002-11-01), Lee
patent: 7-122657 (1995-05-01), None
patent: 00206957 (1999-04-01), None
patent: 00216321 (1999-05-01), None
patent: 20010084781 (2001-09-01), None

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