Field effect transistor with a heterostructure and...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S590000, C438S752000, C438S933000, C438S936000, C257S019000, C257S020000, C257S024000, C257S190000, C257S191000, C257S192000, C257S194000, C257S616000, C257SE29049, C257SE29056

Reexamination Certificate

active

07491612

ABSTRACT:
A field effect transistor with a heterostructure includes a strained monocrystalline semiconductor layer formed on a carrier material, which has a relaxed monocrystalline semiconductor layer made of a first semiconductor material (Si) as the topmost layer. The strained monocrystalline semiconductor layer has a semiconductor alloy (GexSi1-x), where the proportion x of a second semiconductor material can be set freely. Furthermore, a gate insulation layer and a gate layer are formed on the strained semiconductor layer. To define an undoped channel region, drain/source regions are formed laterally with respect to the gate layer at least in the strained semiconductor layer. The possibility of freely setting the Ge proportion x enables a threshold voltage to be set as desired, whereby modern logic semiconductor components can be realized.

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