Fault tolerant selection of die on wafer

Electronic digital logic circuitry – With test facilitating feature

Reexamination Certificate

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Details

C324S765010

Reexamination Certificate

active

11172314

ABSTRACT:
Integrated circuit die on wafer are electronically selected for testing using circuitry (161, 201, PA1–PA4) provided on the wafer.

REFERENCES:
patent: 3708688 (1973-01-01), Yao

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