Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Reexamination Certificate
2005-06-28
2005-06-28
VerSteeg, Steven H. (Department: 1753)
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
C204S192120, C204S298060, C204S298080, C204S298120, C204S298170
Reexamination Certificate
active
06911123
ABSTRACT:
Disclosed is a facing-targets-type sputtering apparatus and method capable of forming a metal film under the conditions of low gas pressure and low discharge voltage. An opening is formed in each of two facing side faces of a vacuum chamber vessel or in each of two facing side faces of a box-type discharge unit attached to an opening portion of a vacuum chamber vessel. The two openings are covered by a pair of cooling blocks. Each cooling block holds a target facing a discharge space. Magnetic field generation means is disposed so as to surround each target and operative to generate a magnetic field that surrounds a discharge space provided between the paired targets. Electron reflection means is disposed above the exposed surface of each target along the periphery of the target. A DC power and a high-frequency power are applied between the vacuum chamber vessel and the targets.
REFERENCES:
patent: 4407894 (1983-10-01), Kadokura et al.
patent: 4784739 (1988-11-01), Kadokura et al.
patent: 4842708 (1989-06-01), Kadokura et al.
patent: 4931169 (1990-06-01), Scherer et al.
patent: 6156172 (2000-12-01), Kadokura
patent: 6328857 (2001-12-01), Anzaki et al.
Proceedings: The 61stSymposium of the Japan Society of Applied Physics, Sep. 2000, 5a-P8-5, 5a-P8-6 (Translation attached).
Abridged translation for JP 62-14633, JP 63-20303, H4-11624, H10-8246.
Armstrong Westerman & Hattori, LLP
FTS Corporation
VerSteeg Steven H.
LandOfFree
Facing-targets-type sputtering apparatus and method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Facing-targets-type sputtering apparatus and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Facing-targets-type sputtering apparatus and method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3470908