Fabrication process of a semiconductor device

Details Fabrication process of a semiconductor device Fabrication process of a semiconductor device

2005-05-10

2005-05-10

Cao, Phat X. (Department: 2814)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S637000, C438S638000

Reexamination Certificate

active

06890848

ABSTRACT:
A method of fabricating a semiconductor device includes the steps of forming a first insulation film on a substrate by a spin-on process, applying a curing process to the first insulation film at a temperature of 380-500° C. over a duration of 5-180 seconds, and forming a second insulation film on the first insulation film by a spin-on process.

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