Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Including heating
Patent
1990-12-20
1992-06-23
Robinson, Ellis P.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Including heating
430315, 430318, 430329, G03C 500
Patent
active
051242389
ABSTRACT:
A method of photolithographically patterning a layer of a dielectric composition including a photosensitive polyimide provides patterned dielectric features that have vertical wall profiles that are free of distortions normally associated with high temperature production conditions and shrinkage of the dielectric composition. The method is useful in the production of integrated circuits and high density multiconnect structures.
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Rubner et al., "A Photopolymer--The Direct Way to Polyimide Patterns", Photographic Science and Engineering, vol. 23, No. 5, Sep.-Oct. 1979, pp. 303-309.
Cech et al., "Photoimageable polyimide: dielectric material for high aspect ratio structures", Reprinted from the Proceedings of SPIE--The International Society for Optical Engineering, vol. 631, Advances in Resist Technology and Processing II, Mar. 10-11, 1986.
Moriya, K., et al., High-density multilayer interconnection with photo-sensitive polyimide dielectric and electroplating conductor, Proceedings 34th Electronic Component Conference, IEEE, pp. 82-87, 1984.
Endo, A., et al., Material and processing technologies of polyimide for advanced electronic devices, J. Electrochem. Soc.: Solid State Science and Technology, 134(10):2522-2527, Oct. 1987.
Pfeifer, J. and Rohde, O., Direct photoimaging of fully imidized solvent-soluble polyimides, Second International Conference on Polyimides, Mid-Hudson Section SPE, Oct. 30-Nov. 1, 1985, Ellenville, N.Y.
Chakravorty Kishore K.
Chien Chung-Ping
Robinson Ellis P.
The Boeing Company
Weddington J.
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