Fabrication of abrupt ultra-shallow junctions

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Amorphous semiconductor

Reexamination Certificate

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C438S473000, C257SE21133

Reexamination Certificate

active

07112516

ABSTRACT:
One aspect of the invention relates to a method of forming P-N junctions within a semiconductor substrate. The method involves providing a temporary impurity species, such as fluorine, within the semiconductor crystal matrix prior to solid source in-diffusion of the primary dopant, such as boron. The impurity atom is a faster diffusing species relative to silicon atoms. During in-diffusion, the temporary impurity species acts to reduce the depth to which the primary dopant diffuses and thereby facilitates the formation of very shallow junctions.

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patent: 2001/0041432 (2001-11-01), Lee
S. Saito, “Defect reduction by MeV ion implantation for shallow junction formation,” Appl. Phys. Lett. vol. 63, No. 2, pp. 197-199. Jul. 12, 1993.
T.H. Huang et al., “Influence of fluorine preamorphization on the diffusion and activation of low-energy implanted boron during rapid thermal annealing,” Appl. Phys. Lett. vol. 65, No. 14, pp. 1829-1831. Oct. 3, 1994.
P. Packan et al., “Modeling Solid Source Boron Diffusion for Advanced Transistor Applications” IEEE, IEDM 98, pp. 505-508.
Daniel F. Downey et al., “Effect of Fluorine on the Diffusion of Boron in Ion Implanted Si” 1998 American Institute of Physics, vol. 73, No. 9, Aug. 31, 1998, pp. 1263-1265.

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