Fabrication method for microstructures with high aspect ratios

Details Fabrication method for microstructures with high aspect ratios Fabrication method for microstructures with high aspect ratios

2006-10-24

2006-10-24

Doan, Theresa T. (Department: 2814)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S672000

Reexamination Certificate

active

07125795

ABSTRACT:
A fabrication method for microstructures with high aspect ratios uses a CMOS process to form a desired microstructure on a silicon substrate. The steps of forming a contact plug and a via plug of the process are used to form etching channels in insulation layers, polysilicon layers and metal layers, penetrating to the silicon substrate. An etching process is then performed through the etching channel to form the desired microstructure with high aspect ratio.

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