Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-11-15
2005-11-15
Weiss, Howard (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S455000
Reexamination Certificate
active
06964882
ABSTRACT:
A flip-bonding technique is used to fabricate complex micro-electromechanical systems. Various micromachined structures are fabricated on the front side of each of two wafers. One of the wafers is flipped over and bonded to the other wafer so that the front sides of the two wafers are bonded together in a flip-stacked configuration.
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Felton Lawrence E.
Gormley Colin
Judy Michael W.
Karpman Maurice S.
Yasaitis John A.
Analog Devices Inc.
Pizarro-Crespo Marcos D.
Weiss Howard
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