Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Forming nonplanar surface
Reexamination Certificate
2007-02-20
2007-02-20
Chu, John S. (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Forming nonplanar surface
C430S394000, C438S446000, C347S233000, C347S234000, C347S235000, C347S239000
Reexamination Certificate
active
10328449
ABSTRACT:
An optical exposure method and a device are used for forming patterns on a printed board wiring or semiconductor board. A single exposing region of a surface to be exposed is irradiated with a plurality of optical beams having different irradiating areas and different scanning pitches, such as, a peripheral area is irradiated with an optical beam having a smaller irradiating area and an inner area is irradiated with an optical beam having a larger irradiating area.
REFERENCES:
patent: 4496216 (1985-01-01), Cowan
patent: 5296958 (1994-03-01), Roddy et al.
patent: 5496768 (1996-03-01), Kudo
patent: 5759744 (1998-06-01), Brueck et al.
patent: 5981974 (1999-11-01), Makita
patent: 6033831 (2000-03-01), Ikeda et al.
patent: 6462879 (2002-10-01), Masuda
patent: 6509955 (2003-01-01), Mei et al.
patent: 2002/0159122 (2002-10-01), Aoki et al.
patent: 2004/0197683 (2004-10-01), Sekigawa et al.
patent: 11195589 (1999-07-01), None
patent: 2000222449 (2000-08-01), None
Akagawa Masatoshi
Sekigawa Kazunari
Chu John S.
Paul & Paul
Shinko Electric Industries Co. Ltd.
LandOfFree
Exposure method and device for forming patterns on printed... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Exposure method and device for forming patterns on printed..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Exposure method and device for forming patterns on printed... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3833166