Exposure method

Details Exposure method Exposure method

1994-02-17

1997-03-11

Church, Craig E.

X-ray or gamma ray systems or devices

Specific application

Lithography

2504921, G21K 500

Patent

active

056109652

ABSTRACT:
A method of exposing a wafer to exposure energy such as ultraviolet rays or X-rays through a mask to transfer a pattern of the mask onto the wafer, for example. The temperature of the mask and/or the wafer increases during the exposure operation by absorption of the exposure energy. While the wafer is being exposed, the temperature of the mask and/or the wafer is detected. If the temperature is going to exceed an exposable temperature range determined on the basis of the line width of the pattern to be transferred, the exposure operation is interrupted. Then, the heat accumulated in the mask and/or the wafer is removed. Thereafter, the exposure operation is resumed. This is repeated until the predetermined or required amount of exposure is reached, for one shot. By this, thermal expansion of the mask and the wafer during the exposure operation is prevented to assure the precision of the pattern transfer.

REFERENCES:
patent: 4692934 (1987-09-01), Forsyth
patent: 4825453 (1989-04-01), Kembo et al.
patent: 4852133 (1989-07-01), Ikeda et al.
patent: 4969168 (1990-11-01), Sakamoto et al.
patent: 5171965 (1992-12-01), Suzuki et al.

Affiliated with

Also associated with

Rating

Exposure method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Exposure method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Exposure method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-449984