Exposing methods in photolithography used for manufacturing a li

Details Exposing methods in photolithography used for manufacturing a li Exposing methods in photolithography used for manufacturing a li

1998-04-28

1999-08-31

McPherson, John A.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430319, 430321, G03F 700

Patent

active

059452560

ABSTRACT:
A substrate for a microelectronic device is divided into at least two regions and a boundary region therebetween. The boundary region includes a first portion and a second portion. The boundary region may have subregions having equal area, and the sub-regions are arranged in a matrix shape to form the first portion and the second portion A photoresist is coated on the substrate. Portions of the photoresist on the first region and the first portion is exposed to light through a mask for photolithography, and other portions of the photoresist on the second region and the second portion is then exposed to light through the mask. The area of the sub-regions of the first portion in a column becomes larger as goes to the first region, while that of the second portion becomes smaller.

REFERENCES:
patent: 5026143 (1991-06-01), Tanaka et al.
patent: 5656526 (1997-08-01), Inada et al.
patent: 5795686 (1998-08-01), Takizawa et al.

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