Exposed pore sealing post patterning

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S759000

Reexamination Certificate

active

07541679

ABSTRACT:
Methods and structures having pore-closing layers for closing exposed pores in a patterned porous low-k dielectric layer, and optionally a reactive liner on the low-k dielectric. A first reactant is absorbed or retained in exposed pores in the patterned dielectric layer and then a second reactant is introduced into openings such that it enters the exposed-pores, while first reactant molecules are simultaneously being outgassed. The second reactant reacts in-situ with the outgassed first reactant molecules at a mouth region of the exposed pores to form the pore-closing layer across the mouth region of exposed pores, while retaining a portion of each pore's porosity to maintain characteristics and properties of the porous low-k dielectric layer. Optionally, the first reactant may be adsorbed onto the low-k dielectric such that upon introduction of the second reactant Into the patterned dielectric openings, a reactive liner is also formed on the low-k dielectric.

REFERENCES:
patent: 5847443 (1998-12-01), Cho et al.
patent: 6008540 (1999-12-01), Lu et al.
patent: 6063714 (2000-05-01), Smith et al.
patent: 6140252 (2000-10-01), Cho et al.
patent: 6156651 (2000-12-01), Havemann
patent: 6351039 (2002-02-01), Jin et al.
patent: 6380075 (2002-04-01), Cabral, Jr. et al.
patent: 6391795 (2002-05-01), Catabay et al.
patent: 6482733 (2002-11-01), Raaijmakers et al.
patent: 6489233 (2002-12-01), Chooi et al.
patent: 6495447 (2002-12-01), Okada et al.
patent: 6528409 (2003-03-01), Lopatin et al.
patent: 6534387 (2003-03-01), Shinogi et al.
patent: 6537896 (2003-03-01), Catabay et al.
patent: 6541842 (2003-04-01), Meynen et al.
patent: 6566283 (2003-05-01), Pangrle et al.
patent: 6583046 (2003-06-01), Okada et al.
patent: 7015150 (2006-03-01), Cooney et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Exposed pore sealing post patterning does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Exposed pore sealing post patterning, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Exposed pore sealing post patterning will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4102300

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.