Evaporation of Y-Si-O films for medium-K dielectrics

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S288000, C257S368000

Reexamination Certificate

active

06930346

ABSTRACT:
A gate oxide and method of fabricating a gate oxide that produces a more reliable and thinner equivalent oxide thickness than conventional SiO2gate oxides are provided. Gate oxides formed from yttrium, silicon, and oxygen are thermodynamically stable such that the gate oxides formed will have minimal reactions with a silicon substrate or other structures during any later high temperature processing stages. The process shown is performed at lower temperatures than the prior art, which inhibits unwanted species migration and unwanted reactions with the silicon substrate or other structures. Using a thermal evaporation technique to deposit the layer to be oxidized, the underlying substrate surface smoothness is preserved, thus providing improved and more consistent electrical properties in the resulting gate oxide.

REFERENCES:
patent: 3381114 (1968-04-01), Nakanuma
patent: 4215156 (1980-07-01), Dalal et al.
patent: 4333808 (1982-06-01), Bhattacharyya et al.
patent: 4394673 (1983-07-01), Thompson et al.
patent: 4399424 (1983-08-01), Rigby
patent: 4413022 (1983-11-01), Suntola et al.
patent: 4590042 (1986-05-01), Drage
patent: 4647947 (1987-03-01), Takeoka et al.
patent: 4767641 (1988-08-01), Kieser et al.
patent: 4920071 (1990-04-01), Thomas
patent: 4993358 (1991-02-01), Mahawili
patent: 5006192 (1991-04-01), Deguchi
patent: 5055319 (1991-10-01), Bunshah et al.
patent: 5080928 (1992-01-01), Klinedinst et al.
patent: 5595606 (1997-01-01), Fujikawa et al.
patent: 5621681 (1997-04-01), Moon
patent: 5698022 (1997-12-01), Glassman et al.
patent: 5735960 (1998-04-01), Sandhu et al.
patent: 5744374 (1998-04-01), Moon
patent: 5795808 (1998-08-01), Park
patent: 5801105 (1998-09-01), Yano et al.
patent: 5810923 (1998-09-01), Yano et al.
patent: 5822256 (1998-10-01), Bauer et al.
patent: 5828080 (1998-10-01), Yano et al.
patent: 5840897 (1998-11-01), Kirlin et al.
patent: 5916365 (1999-06-01), Sherman
patent: 5950925 (1999-09-01), Fukunaga et al.
patent: 5972847 (1999-10-01), Feenstra et al.
patent: 6013553 (2000-01-01), Wallace et al.
patent: 6020024 (2000-02-01), Maiti et al.
patent: 6027961 (2000-02-01), Maiti et al.
patent: 6057271 (2000-05-01), Kenjiro et al.
patent: 6059885 (2000-05-01), Ohashi et al.
patent: 6093944 (2000-07-01), VanDover
patent: 6110529 (2000-08-01), Gardiner et al.
patent: 6161500 (2000-12-01), Kopacz et al.
patent: 6171900 (2001-01-01), Sun
patent: 6203613 (2001-03-01), Gates et al.
patent: 6206972 (2001-03-01), Dunham
patent: 6207589 (2001-03-01), Ma et al.
patent: 6211035 (2001-04-01), Moise et al.
patent: 6225168 (2001-05-01), Gardner et al.
patent: 6232847 (2001-05-01), Marcy, 5th et al.
patent: 6281144 (2001-08-01), Cleary et al.
patent: 6291866 (2001-09-01), Wallace et al.
patent: 6297516 (2001-10-01), Forrest et al.
patent: 6297539 (2001-10-01), Ma et al.
patent: 6302964 (2001-10-01), Umotoy et al.
patent: 6303481 (2001-10-01), Park
patent: 6348386 (2002-02-01), Gilmer
patent: 6368941 (2002-04-01), Chen et al.
patent: 6380579 (2002-04-01), Nam et al.
patent: 6387712 (2002-05-01), Yano et al.
patent: 6391769 (2002-05-01), Lee et al.
patent: 6420279 (2002-07-01), Ono et al.
patent: 6432779 (2002-08-01), Hobbs et al.
patent: 6444039 (2002-09-01), Nguyen
patent: 6444895 (2002-09-01), Nikawa
patent: 6445023 (2002-09-01), Vaartstra et al.
patent: 6448192 (2002-09-01), Kaushik
patent: 6451641 (2002-09-01), Halliyal et al.
patent: 6451695 (2002-09-01), Sneh
patent: 6458701 (2002-10-01), Chae et al.
patent: 6465334 (2002-10-01), Buynoski et al.
patent: 6482740 (2002-11-01), Soininen et al.
patent: 6495436 (2002-12-01), Ahn et al.
patent: 6514828 (2003-02-01), Ahn et al.
patent: 6521911 (2003-02-01), Parsons et al.
patent: 6534420 (2003-03-01), Ahn et al.
patent: 2001/0009695 (2001-07-01), Saanila et al.
patent: 2001/0051442 (2001-12-01), Katsir et al.
patent: 2001/0053082 (2001-12-01), Chipalkatti et al.
patent: 2002/0022156 (2002-02-01), Bright
patent: 2002/0089023 (2002-07-01), Yu et al.
patent: 2002/0119297 (2002-08-01), Forrest et al.
patent: 2002/0146916 (2002-10-01), Irino et al.
patent: 2002/0155688 (2002-10-01), Ahn et al.
patent: 2002/0155689 (2002-10-01), Ahn et al.
patent: 2002/0192974 (2002-12-01), Ahn et al.
patent: 2003/0001241 (2003-01-01), Chakrabarti et al.
patent: 2003/0003702 (2003-01-01), Ahn et al.
patent: 2003/0017717 (2003-01-01), Ahn et al.
patent: 62-199019 (1987-09-01), None
patent: 5090169 (1993-04-01), None
patent: 2001-332546 (2001-11-01), None
Aarik, Jaan , et al., “Atomic layer growth of epitaxial TiO/sub 2/ thin films from TiCl/sub 4/ and H/sub 2/O on alpha -Al/sub 2/O/sub 3/ substrates”,Journal Crystal Growth, 242(1-2), (2002), 189-198.
Aarik, Jaan , et al., “Influence of substrate temperature on atomic layer growth and properties of HfO/sub 2/ thin films”,Thin Solid Films, 340(1-2), (1999),110-116.
Aarik, Jaan , et al., “Phase transformations in hafnium dioxide thin films grown by atomic layer doposition at high temperatures”,Applied Surface Science, 173(1-2), (Mar. 2001),15-21.
Aarik, Jaan , et al., “Texture Development in nanocrystalline hafnium dioxide thin films grown by atomic layer deposition”,Journal of Crystal Growth, 220, (2000), 105-113.
Alen, Petra , “Atomic Layer deposition of Ta(Al)N(C) thin films using trimethylaluminum as a reducing agent”,Journal of the Electrochemical Society, 148(10), (Oct. 2001),G566-G571.
Bendoraitis, J G., et al., “Optical energy gaps in the monoclinic oxides of hafnium and zirconium and their solid solutions”,Journal of Physical Chemistry, 69(10), (1965),3666-3667.
Bright, A A., et al., “Low-rate plasma oxidation of Si in a dilute oxygen/helium plasma for low-temperature gate quality Si/Sio2 interfaces”,Applied Physics Letters, 58(6), (Feb. 1991),619-621.
Bunshah, Rointan F., et al., “Deposition Technologies for Films and Coatings: Developments and Applications”,Park Ridge, N.J., U.S.A. ; Noves Publications, (1982),102-103.
Cava, RJ., “Improvement of the dielectric properties of Ta/sub 2/O/sub 5/ through substitution with Al/sub 2/O/sub 3/”,Applied Physics Letters, 70(11), (Mar. 1997),1396-8.
Chambers, J J., et al., “Physical and electrical characterization of ultrathin yttrium silicate insulators on silicon”,Journal of Applied Physics, 90(2), (Jul. 15, 2001),918-33.
Cheng, Baohong , et al., “The Impact of High-k Gate Dielectrics and Metal Gate Electrodes on Sub-100nm MOSFET's”,IEEE Transactions on Electron Devices, 46(7), (Jul. 1999), 1537-1544.
Copel, M. , “Structure and stability of ultrathin zirconium oxide layers on Si(001)”,Applied Physics Letters, 76(4), (Jan. 2000),436-438.
De Flaviis, Franco , et al., “Planar microwave integrated phase-shifter design with high purity ferroelectric material”,IEEE Transactions on Microwave Theory&Techniques, 45(6), (Jun. 1997),963-969.
Desu, S B., “Minimization of Fatigue in Ferroelectric Films”,Physica Status Solidi A, 151(2), (1995),467-480.
Dusco, C , et al., “Deposition of tin oxide into porous silicon by atomic layer epitaxy”,Journal of the Electrochemical Society, 143, (1996),683-687.
El-Kareh, B , et al., “The evolution of DRAM cell technology”,Solid State Technology, 40(5), (1997),89-90, 92, 95-6, 98, 100-1.
Engelhardt, M. , “Modern Applications of Plasma Etching and Patterning in Silicon Process Technology”,Contributions to Plasma Physics, 39(5), (1999),473-478.
Forsgren, Katarina , “Atomic Layer Deposition of HfO2 using hafhium iodide”,Conference held in Monterey, California, (May 2001), 1 page.
Fuyuki, Takashi , et al., “Electronic Properties of the Interface between Si and TiO2 Deposited at Very Low Temperatures”,Japanese Journal of Applied Physics, Part 1(Regular Papers&Short Notes),25(9), (Sep. 1986),1288-1291.
Fuyuki, Takashi , et al., “Initial stage of ultra-thin SiO/sub 2/ formation at low temperatures using activated oxygen”,Applied Surface Science, 11

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Evaporation of Y-Si-O films for medium-K dielectrics does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Evaporation of Y-Si-O films for medium-K dielectrics, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Evaporation of Y-Si-O films for medium-K dielectrics will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3523689

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.