Etching method using a PVA stencil containing N-methylol acrylam

Details Etching method using a PVA stencil containing N-methylol acrylam Etching method using a PVA stencil containing N-methylol acrylam

1981-06-02

1982-07-13

Kimlin, Edward C.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

430 28, 430283, 430289, 430318, 430329, 1566591, 156904, C23F 102, G03C 500

Patent

active

043395295

ABSTRACT:
The method comprises producing on the surface to be etched a stencil of a light-hardened PVA. The stencil is produced by light hardening selected portions of a film or coating consisting essentially of dichromate-sensitized PVA containing about 5 to 30 weight percent with respect to the weight of PVA solids of N-methylol acrylamide. After light hardening, the nonhardened portions of the film are removed, thereby producing the stencil. The stencil is baked to improve its etch resistance, the surface is etched through the stencil, and then the stencil is removed from the surface.

REFERENCES:
patent: 3589907 (1971-06-01), Dijkstra
patent: 3625746 (1971-12-01), Ayukawa et al.
patent: 3730933 (1973-05-01), Stehle et al.
patent: 3925289 (1975-12-01), Sakato et al.
patent: 4061529 (1977-12-01), Goldman et al.
patent: 4158566 (1979-06-01), Goldman
patent: 4208242 (1980-06-01), Zampiello

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