Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1989-05-04
1991-04-16
Fisher, Richard V.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156668, 156345, 437229, 20419232, H01L 21306
Patent
active
050079832
ABSTRACT:
A method for etching or removing polymers, photoresists, and organic contaminants from a substrate is disclosed. The method includes creating a more reactive gas species by producing a plasma discharge in a reactive gas such as oxygen and contacting the resulting gas species with a sacrificial solid organic material (13A) such as polyethylene or poly(vinyl fluoride), producing a highly reactive gas species, which in turn etches the starting polymer, organic contaminant, or photoresist (13). The sample to be etched is located away from the plasma glow discharge region (11) so as to avoid damaging the substrate by exposure to high-energy particles and electric fields encountered in that region. Greatly increased etching rates are obtained. This method is highly effective for etching polymers such as polyimides and photoresists that are otherwise difficult or slow to etch downstream from an electric discharge in a reactive gas.
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Lerner Narcinda R.
Wydeven, Jr. Theodore J.
Adams Harold W.
Brekke Darrell G.
Burns Todd J.
Fisher Richard V.
Manning John R.
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