Etching a substrate in a process zone

Details Etching a substrate in a process zone Etching a substrate in a process zone

2005-06-14

2005-06-14

Goudreau, George A. (Department: 1763)

Radiation imagery chemistry: process, composition, or product th

Radiation modifying product or process of making

Radiation mask

C438S714000, C438S725000, C438S717000, C438S736000, C438S738000, C438S723000, C438S724000, C134S001200, C134S001300

Reexamination Certificate

active

06905800

ABSTRACT:
A substrate processing method comprises providing a substrate105comprising etch resistant material210in a process zone155, such as an energized gas zone in a process chamber110. The etch resistant material210may comprise a resist material230over mask material240. The process may further comprise removing the etch resistant material210, such as the resist material230, in the process zone155before etching underlying layers.

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