Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate
2006-11-14
2006-11-14
Norton, Nadine (Department: 1765)
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
C438S723000, C438S724000, C156S345330
Reexamination Certificate
active
07135410
ABSTRACT:
A method for etching a feature in an etch layer through a mask over a substrate. The substrate is placed in a process chamber. An etch plasma is provided to the process chamber, where the etch plasma begins to etch. A feature is etched in the etch layer with the etch plasma. At least one etch plasma parameter is ramped during the etching of the feature to optimize plasma parameters with the changing etch depth and the feature is etched with the ramped plasma until the feature is etched to a feature depth.
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International Search Report, mailed on Dec. 15, 2004.
Eppler Aaron
Jacobs Keren
Beyer Weaver & Thomas LLP
Lam Research Corporation
Norton Nadine
Tran Binh X.
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