Etch enhancement using an improved gas distribution plate

Details Etch enhancement using an improved gas distribution plate Etch enhancement using an improved gas distribution plate

1996-04-25

1998-10-13

Scheiner, Laurie

Drying and gas or vapor contact with solids

Apparatus

Houses, kilns, and containers

34 92, 34229, 34235, 156345, F26B 1900

Patent

active

058194347

ABSTRACT:
A thin gas distribution plate is provided, consistent with requirements for mechanical rigidity and strength. The gas distribution plate has sufficiently low mass to permit rapid heating to an equilibrium temperature as determined by radiated heat loss. The gas distribution plate has a thinner central cross-section, optionally including smaller diameter apertures formed therethrough; and has a thicker circumferential cross-section, optionally having larger apertures formed therethrough, to thereby promote even gas distribution across the surface of the wafer, while mitigating or eliminating entirely the first wafer effect.

REFERENCES:
patent: 5177878 (1993-01-01), Visser

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