Erosion lithography to abrade a pattern onto a substrate

Details Erosion lithography to abrade a pattern onto a substrate Erosion lithography to abrade a pattern onto a substrate

1980-05-12

1981-06-09

Kimlin, Edward C.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

51 5A, 51310, 51311, 51312, 51319, 51439, 156640, 156644, 156645, 427264, 427272, 427348, 430316, 430318, 430319, 430401, G03C 500, B24B 700

Patent

active

042726123

ABSTRACT:
A variety of technologies have been applied in the development of a bonded rid cathode. Erosion lithography is used for making the fine-detail grid structure, combining air erosion and lithographic techniques. To obtain openings of the order of 0.001 inch (one mil) or smaller, a nozzle with a high aspect ratio exit opening is used, and the cathode grid structure is scanned. A photo resist in which the grid pattern is developed is used over the molybdenum or tungsten grid film. The metal film is removed from the grid openings by chemical etching. The photo resist over the metal grid is used as a composite mask for removing the BN insulation in the openings by erosion with Al.sub.2 O.sub.3 powder from the special nozzle on the air blast gun.

REFERENCES:
patent: 3032930 (1962-05-01), Williams
patent: 3257759 (1966-06-01), Millhiser
patent: 3392052 (1968-07-01), Davis
patent: 3561163 (1971-02-01), Arnold
patent: 3694260 (1972-09-01), Beggs
patent: 3710515 (1973-01-01), Kulischenko et al.

Affiliated with

Also associated with

Rating

Erosion lithography to abrade a pattern onto a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Erosion lithography to abrade a pattern onto a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Erosion lithography to abrade a pattern onto a substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1264842