Epoxy resin molding for sealing electronic parts containing orga

Details Epoxy resin molding for sealing electronic parts containing orga Epoxy resin molding for sealing electronic parts containing orga

1995-09-29

1998-04-14

Sellers, Robert E.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525902, C08L 6302, C08L 6304

Patent

active

057392170

ABSTRACT:
An epoxy resin molding material comprising an epoxy resin, a phenolic resin and a powder flexibilizer which has a core-shell structure composed of a solid silicone core and an organic polymer shell is a reliable epoxy resin molding material for sealing electronic parts which is excellent in, for example, thermal shock resistance and reflow soldering resistance, and is free from the troublesome deterioration in, for example, the appearance and marking properties of molded products, and to provide a semiconductor sealed by the molding material.

REFERENCES:
patent: 5147947 (1992-09-01), Yamamoto et al.
patent: 5312878 (1994-05-01), Shiobara et al.
Patent Abstacts of Japan, vol. 12, No. 72 (E-588) (2919) 5 Mar. 1988.

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