Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2005-05-31
2005-05-31
Hamilton, Cynthia (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S326000, C526S256000, C526S268000
Reexamination Certificate
active
06899990
ABSTRACT:
Epoxy compounds of formula (1) are provided wherein W is CH2, O or S, X and Y are —CR1R2— or —C(═O)—, k is 0 or 1, R1and R2are H or alkyl, or R1and R2, taken together, may form an aliphatic hydrocarbon ring with the carbon atom to which they are connected. A resist composition comprising a polymer having recurring units of the epoxy compound as a base resin is sensitive to high-energy radiation, has excellent sensitivity, resolution, etching resistance, and minimized swell and lends itself to micropatterning with electron beams or deep-UV.
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patent: 2002/0001772 (2002-01-01), Nishi et al.
patent: WO-00/53658 (2000-09-01), None
Grant et al, eds, Grant & Hackh's Chemical Dictionary, Fifth Ed, McGraw-Hill Book Company, New York, N.Y., 1987, p. 216.*
Gannon, John, “Epoxy Resins”, Kirk-Othmeri Encyclopedia of Chemical Technology, 1994, John Wiley & Sons, Inc, one page, Abstract, from online version at www.mrw.interxcience.wiley,com/kirk/articles/epoxgann.a01/abstract.
Hasegawa Koji
Kinsho Takeshi
Nishi Tsunehiro
Watanabe Takeru
Hamilton Cynthia
Millen White Zelano & Branigan P.C.
Shin-Etsu Chemical Co. , Ltd.
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