Epitaxially coated semiconductor wafers having low-oxygen zone o

Single-crystal – oriented-crystal – and epitaxy growth processes; – Forming from vapor or gaseous state – With decomposition of a precursor

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117935, C30B 2502

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active

053558316

ABSTRACT:
For the production of high-quality electronic components based on semiconductors, semiconductor wafers are needed which have a substantially lower oxygen concentration in the wafer region near the surface in which the components are integrated than in the other wafer region. This region, known as "denuded zone," was hitherto obtained by prolonged heat treatment of the wafers in a batch reactor as a consequence of partial diffusion of the oxygen out from the substrate. In the process according to the invention, the low-oxygen region is produced by the epitaxial deposition of two differently doped semiconductor layers on the wafer surface in a single-wafer reactor.

REFERENCES:
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patent: 4522662 (1985-06-01), Bradbury et al.
patent: 4834831 (1989-05-01), Nishizawa et al.
1046b Extended Abstracts, Fall Meeting, Seattle, Wash., Oct. 14-19, 1990 2 (1990), Princeton, N.J., US, pp. 576-577.
Journal of the Electrochemical Society, vol. 122, No. 11, Nov. 1975, Manchester, N.H., US, pp. 1523-1531, T. Ishii et al. "Silicon Epitaxial Wafer with abrupt interface by two-step epitaxial growth technique" p. 1526, col. 1. para. 1, p. 1527, col. 1, para. 2.
Solid State Technology 11(6) 1988, p. 24 (The Device and circuit manufacturers' journal).
Solid State Technology, Aug. 1983, Precipitation Process Design for Denuded Zone Formation in CZ-Silicon Wafers, Diethard Huber, Joseph Reffle, pp. 137-142.

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