Epitaxial semiconductor deposition methods and structures

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – On insulating substrate or layer

Reexamination Certificate

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C257S190000

Reexamination Certificate

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11506320

ABSTRACT:
Methods for depositing epitaxial films such as epitaxial Ge and SiGe films. During cooling from high temperature processing to lower deposition temperatures for Ge-containing layers, Si or Ge compounds are provided to the substrate. Smooth, thin, relatively defect-free Ge or SiGe layers result. Retrograded relaxed SiGe is also provided between a relaxed, high Ge-content seed layer and an overlying strained layer.

REFERENCES:
patent: 5221413 (1993-06-01), Brasen et al.
patent: 5221556 (1993-06-01), Hawkins et al.
patent: 5256550 (1993-10-01), Laderman et al.
patent: 5442205 (1995-08-01), Brasen et al.
patent: 5879970 (1999-03-01), Shiota et al.
patent: 5891769 (1999-04-01), Liaw et al.
patent: 6030894 (2000-02-01), Hada et al.
patent: 6093252 (2000-07-01), Wengert et al.
patent: 6107653 (2000-08-01), Fitzgerald
patent: 6319782 (2001-11-01), Nakabayashi
patent: 6373112 (2002-04-01), Murthy et al.
patent: 6455871 (2002-09-01), Shim et al.
patent: 6537370 (2003-03-01), Hernandez et al.
patent: 6562736 (2003-05-01), Yanagawa et al.
patent: 6573126 (2003-06-01), Cheng et al.
patent: 6592942 (2003-07-01), Van Wijck
patent: 6633066 (2003-10-01), Bae et al.
patent: 6645836 (2003-11-01), Kanzawa et al.
patent: 6713326 (2004-03-01), Cheng et al.
patent: 6844213 (2005-01-01), Sparks
patent: 6855649 (2005-02-01), Christiansen et al.
patent: 6858502 (2005-02-01), Chu et al.
patent: 6875279 (2005-04-01), Chu et al.
patent: 6900115 (2005-05-01), Todd
patent: 6958253 (2005-10-01), Todd
patent: 6995076 (2006-02-01), Wang et al.
patent: 2002/0168868 (2002-11-01), Todd
patent: 2002/0173130 (2002-11-01), Pomerede et al.
patent: 2003/0022528 (2003-01-01), Todd
patent: 2003/0044309 (2003-03-01), Hernandez et al.
patent: 2003/0045063 (2003-03-01), Oda
patent: 2003/0082300 (2003-05-01), Todd et al.
patent: 2003/0124818 (2003-07-01), Luo et al.
patent: 2003/0157787 (2003-08-01), Murthy et al.
patent: 2003/0190791 (2003-10-01), Fischetti et al.
patent: 2003/0207127 (2003-11-01), Murthy et al.
patent: 2003/0235931 (2003-12-01), Wada et al.
patent: 2004/0097022 (2004-05-01), Werkhoven et al.
patent: 2004/0217845 (2004-11-01), Silver et al.
patent: 2004/0219735 (2004-11-01), Brabant et al.
patent: 2005/0079692 (2005-04-01), Samilov et al.
patent: 2006/0216417 (2006-09-01), Todd et al.
patent: 0 858 101 (1998-02-01), None
patent: WO 00/15885 (2000-03-01), None
patent: WO 01/41544 (2001-06-01), None
Bauer et al., “Relaxed SiGe buffers with thicknesses below 0.1 μm”,Thin Solid Films369:152-156 (2000).
Bauer et al., “High Ge content photodetectors on thin SiGe buffers”,Materials Science and EngineeringB89:77-83 (2002).
Bensahel et al., “Single-wafer processing of in-situ doped polycrystalline Si and Si1-xGex”,Solid State Technology, pp. S5-S10 (Mar. 1998).
Chui et al., “Ultrathin high-κ gate dielectric technology for germanium MOS applications”,IEEE 60th Annual Device Research Conference(DRC)Digest, paper VII.B2, pp. 191-192 (2002).
Colace et al., “Ge/Si(001) photodetector for near infrared light”,Solid State Phenomena54:55-58 (1997).
Colace et al., “Metal-semiconductor-metal near-infrared light detector based on epitaxial Ge/Si”,Applied Physics Letters72:3175-3177 (1998).
Colace et al., “Metal-Ge-Si diodes for near-infrared light detection”,Journal of Vacuum Science and Technology B17:465 (1999).
Currie et al., “Controlling threading dislocation densities in Ge on Si using graded SiGe layers and chemical-mechanical polishing”,Applied Physics Letters72:1718-1720 (1998).
Fischetti et al., “Band structure, deformation potentials, and carrier mobility in strained Si, Ge, and SiGe alloys”,Journal of Applied Physics80:2234-2252 (1996).
Giovane et al., “Correlation between leakage current density and threading dislocation density in SiGe p-i-n diodes grown on relaxed graded buffer layers”,Applied Physics Letters78:541-543 (2001).
Hartmann et al., “Reduced pressure-chemical vapor deposition of Ge thick layers on Si(001) for 1.3-1.55-μm photodetection”,Journal of Applied Physics95:5905-5913 (2004).
Jackson et al., “Gate-Self-Aligned p-Channel Germanium MISFET's”,IEEE Electron Device Letters12:605-607 (1991).
Kasper, “Prospects of SiGe Heterodevices”,Journal of Crystal Growth150:921-925 (1995).
Kasper et al., “New virtual substrate concept for vertical MOS transistors”,Thin Solid Films336:319-322 (1998).
Lee et al., “Strained Ge channel p-type metal-oxide-semiconductor field-effect transistors grown on Si1-xGex/Si virtual substrates”,Applied Physics Letters79:3344-3346 (2001).
Lee et al., “Strained Si/strained Ge dual-channel heterostructures on Relaxed Si0.5Ge0.5for symmetric mobilityp-type andn-type metal-oxide-semiconductor field-effect transistors”,Applied Physics Letters83:4202-4204 (2003).
Lee et al., “Electron mobility characteristics ofn-channel metal-oxide-semiconductor field-effect transistors fabricated on Ge-rich single- and dual-channel SiGe heterostructures”,Journal of Applied Physics95:1550-1555 (2004).
Letertre et al., “Germanium-on-insulator (GeOl) structure realized by the Smart Cut™ technology”,MRS Proceedings, vol. 809 (2004).
Lyutovich et al., “Interaction between point defects and dislocations in SiGe”,Solid State Phenomena69-70:179-184 (1999).
Lyutovich et al., “Relaxed SiGe buffer layer growth with point defect injection”,Materials Science and EngineeringB71:14-19 (2000).
Lyutovich et al., “Thin SiGe buffers with high Ge content forn-MOSFETs”,Materials Science and EngineeringB89:341-345 (2002).
Ni et al., “X-ray reciprocal space mapping studies of strain relaxation in thin SiGe layers (≦100 nm) using a low temperature growth step”,Journal of Crystal Growth277-228:756-760 (2001).
Reinking et al., “Ge p-MOSFETs compatible with Si CMOS-technology”,Proceedings of the 29th ESSDERC99:300-303 (1999).
Samavedam et al., “High-quality germanium photodiodes integrated on silicon substrates using optimized relaxed graded buffers”,Applied Physics Letters73:2125-2127 (1998).
Schöllhorn et al., “Coalescence of germanium islands on silicon”,Thin Solid Films336:109-111 (1998).
Shang et al., “Electrical characterization of germaniump-channel MOSFETs”,IEEE Electron Device Letters24:242-244 (2003).
Thomas et al., “Structural characterization of thick, high-quality epitaxial Ge on Si substrates grown by low-energy plasma-enhanced chemical vapor deposition”,Journal of Electronic Materials32:976-980 (2003).
“Physics of Thin Films”, printed from http://www.uccs.edu/˜tchriste/courses/PHYS549/549lectures/film2.html (Feb. 22, 2000).
Cannon; D. et al., “Tensile strained epitaxial Ge films on Si(100) substrates with potential application in L-band telecommunications,” Applied Physics Letters, vol. 84, No. 6, Feb. 9, 2004, pp. 906-908.
Colace, L. et al., “Efficient high-speed near-infrared Ge photodetectors integrated on Si substrates,” Applied Physics Letters, vol. 76, No. 10, Mar. 6, 2000, pp. 1231-1233.
Colace, L. et al., “Ge-on-Si Approaches to the Detection of Near-Infrared Light,” IEEE Journal of Quantum Electronics, vol. 35, No. 12, Dec. 1999, pp. 1843-1852.
Fama, S. et al., “High performance germanium-on-silicon detectors for optical communications,” Applied Physics Letters, vol. 81, No. 4, Jul. 22, 2002, pp. 586-588.
Hull, R., “Metastable strained layer configurations in the SiGe/Si system,” (1999)EMIS Datareviews, Series No. 24: Properties of SiGe and SiGe:C, edited by Erich Kasper et al., INSPEC (2000), London, UK.
Ishikawa, Y. et al., “Strain-induced band gap shrinkage in Ge grown on Si substrate,” Applied Physics Letters, vol. 82, No. 12, Mar. 31, 2003, pp. 2044-2046.
Lee et al., “Growth of stra

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