Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2008-03-04
2008-03-04
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
Reexamination Certificate
active
10534695
ABSTRACT:
An epitaxial growth method includes: supporting a substrate for growth (for example, an InP substrate) with a substrate supporter, growing a compound semiconductor layer comprising 3 or 4 elements (for example, a III-V group compound semiconductor such as an InGaAs layer, AlGaAs layer, AlInAs layer and AlInGaAs layer) on the substrate for growth by metal organic chemical vapor deposition, polishing the substrate so that an angle of gradient is 0.00° to 0.03° or 0.04° to 0.24° with respect to (100) direction in the entire effective area of the substrate, and forming the compound semiconductor layer to be 0.5 μm thick or more on the substrate by using the substrate for growth.
REFERENCES:
patent: 5647917 (1997-07-01), Oida et al.
patent: 2-239188 (1990-09-01), None
patent: 8-330236 (1996-12-01), None
patent: 2750331 (1998-02-01), None
Nakamura et al., Journal of Crystal Growth, vol. 129, 1993, pp. 456-464.
Kurita Hideki
Nakamura Masashi
Birch & Stewart Kolasch & Birch, LLP
Harrison Monica D.
Jr. Carl Whitehead
Nippon Mining & Metals Co., Ltd.
LandOfFree
Epitaxial growth method and substrate for epitaxial growth does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Epitaxial growth method and substrate for epitaxial growth, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Epitaxial growth method and substrate for epitaxial growth will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3908383